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AFFORDABLE SOLUTIONS, INC.
Your Technical Staffing Specialists

Job Description:
Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of
hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to
.001 mil, very high semiconductor chip density, unusual substrate configurations which require special setup
and bonding techniques. Requires the capability to troubleshoot defective hybrids by visual or mechanical
screening, wirebonds or chip placement. Perform wire and ribbon bonding to duroid, ceramic, capacitors,
resistors, diodes, and spirals. Duties include installation of substrates and components in highly complex
microwave assemblies, wire bonding using manual .001 and .0007 machines, and substrate and component
attachment using paste and sheet epoxies. Experience required using Westbond and Metcal bonding machines
and Unitech welder. Defense industry experience; familiarity with ESD & FOD protection requirements; good
verbal and written communication skills; ability to work from detailed process sheets and drawings, work under
a microscope, and use hand tools; good hand/eye coordination and computer skills are required. Must have at
minimum an interim clearance to start. 4/10 schedule.
Assembler/Hybrid/Wirebonder
Position: Contract
Shift: 1st
Location: Chelmsford Area